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你的未来到底是怎样?
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首先,让我们进入“铁三角”之计算光刻环节
在光刻机对晶圆进行曝光之前,需要通过计算光刻软件的数学物理模型来精确仿真光刻中真实的物理化学过程,得到解决方案,实现高保真度曝光。
所以想要成为ASML“良率守护神”,让我们先来零距离体验下吧。
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由于光刻机光学系统的非完美性及光路中的光学衍射效应,曝光在晶圆上的最终图形会和掩模版上的原始图形产生偏差。
为了使光刻成像尽量接近芯片设计图形,光学邻近效应校正(OPC)作为计算光刻的关键技术之一,将通过对掩模版形状进行迭代优化,从而使曝光后获得的图形满足设计要求。
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返回获取考点
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Get知识点√,继续 >>
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OPC类似于美图秀秀中的修图,本轮考核我们需要修复的对象是ASML中的字母“L” 。如果我们直接把原始 L掩模版(左图)放到光刻机内进行曝光,晶圆上得到的图像将如下右图蓝色实心区域所示,这与理想图形相差甚远。现在,请你根据提示对掩模版图形进行调整,使得晶圆上得到的图像尽可能接近目标图形,即填满整个虚线L 。我们开始吧!
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当前掩模版图形
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当前成像
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返回获取考点
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开始修图 >>
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首先,请从1-3 号中选择合适的掩模版对“L”进行调整,使得晶圆成像更丰满,但又仍在目标图形内。
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1号掩模版
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2号掩模版
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3号掩模版
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当前掩模版图形
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当前成像
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返回获取考点
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下一步 >>
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Cool!感觉好很多了,当前的光刻成像已接近目标图形,但我们还需要些细节上的调整,请拖动合适的版块至当前掩模版图形,对“L”的两端及两个拐角处进行修正。
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当前掩模版图形
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当前成像
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返回获取考点
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下一步 >>
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近乎完美!感谢你的细致与耐心,对掩模版形状进行迭代优化,至少目前为止这个光刻成像已经“尽它所能”,非常接近我们的目标芯片设计图形了,恭喜过关!
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当 前 掩 模 版 图 形
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当 前 成 像
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返回获取考点
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下一个考核 >>
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恭喜完成第一轮考核!
下面我们将进入大家熟知的光刻环节!光刻机台会将芯片所需的电路图案投射到晶圆上,它有着极其精妙的构造和复杂的零部件,就像充满奥秘的人体。所以想要成为ASML“光刻护卫队”,需要对光刻机台内部模组的一切都了如指掌。
第二轮考核,让我们来看看你对光刻机台内部的构造到底了解多少!
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请正确匹配下侧的模组名称
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掩模版传送模组
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晶圆传送模组
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照明模组
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- {{item2.text}}
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返回获取考点
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下一步 >>
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掩模版传送模组
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晶圆传送模组
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照明模组
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{{page5_2_questions[2].text}}
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返回获取考点
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下一步 >>
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Good job! 现在是最后一关!
芯片制造过程中难免会出现误差,这时候我们的“百万级品控师”ASML电子束量测闪亮登场! HMI设备作为高精度量测工具,它将能发现单个芯片上极其细微的错误。听说高分辨率电子束量测系统 eP5甚至可提供1 纳米分辨率和百万级大视场!所以如果你想成为ASML“百万级品控师”,细节控+火眼金睛可是必备技能!赶紧来测测看你是否具备吧 >>
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左边为设计图,对比看右图中共有几处缺陷?
找出四处即可过关!
已全部找到!
已找到{{lcData.findCount}}处
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设 计 图
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成 像 图
已认证“火眼金睛”
稍等,还有一步!为支持产品的制程控制优化,
进而提高生产良率,我们还需要将这些误差
反馈至各相关制程 >>
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返回获取考点
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已反馈至各相关制程,生产良率得以进一步提高!
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为了进一步提升芯片产能和良率、助推芯片的大规模稳定量产,ASML 更是打造了全新的数字化平台——Litho InSight。它贯穿于光刻全过程,赶快点击启动,请它来帮忙,看看它是如何赋能 ASML“铁三角”的吧 ↓↓
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点击启动 Litho InSight
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你已完成所有考核内容!请填写姓名,即可
获取你的职业测评成绩及分析报告
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滑动选取你的理想职位
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